The TGH960 from DFI is a Type 6 COM Express compact-sized module (95mm x 95mm) powered by an 11th Gen Intel Core i7/i5/i3 'Tiger Lake' U-series SoC. It supports up to 64GB of DDR4-3200MHz SO-DIMM memory and provides triple display support with VGA, LVDS, eDP, and DDI options. The module includes 1x 2.5Gigabit Ethernet port and supports 2x SATA ports, 4x USB 3.2 Gen2 ports, 8x USB 2.0 ports, and 2x COM ports. Expansion options include up to 5x PCIe x1, 1x PCIe x4, as well as I2C and SMBus. The TGH960 also offers 8-bit GPIO and optional TPM support. It operates within a temperature range of 0°C to +60°C, with -40°C to +85°C options available for wide-temperature models.
Impulse can support and assist you in the development of your SoM (System-on-Module) based project. In addition, Impulse can supply the TGH960 CPU module fully configured with a suitable carrier board and board support package.
For more information about the TGH960 system-on-module and our embedded system services please contact our technical sales team on +44 (0)1782 337 800 or alternatively submit an enquiry.
Features
- Type 6 COM Express compact size module (95mm x 95mm)
- On-board 11th Gen. Intel Core i7/i5/i3 'Tiger Lake' U-series SoC
- Supports up to 64GB of DDR4-3200MHz SO-DIMM memoryTriple display support - VGA/LVDS/eDP/DDI
- 1x 2.5Gigabit Ethernet port
- Supports 2x SATA ports, 4x USB3.2 Gen2 ports, 8x USB2.0 ports and 2x COM ports
- Supports up to 5x PCIe [x1], 1x PCIe [x4], I2C and SMBus expansion
- 8-bit GPIO and optional TPM support
- 0°C to +60°C operating temperature (-40°C to +85°C with WT models)