ARK-1551

Fanless

These products use heatsink, heatpipe and extrusion technology to dissipate the heat generated by the system rather than using traditional fans thus improving system reliability and longevity.

Wide Temperature

These products utilise high quality industrial grade components enabling them to work in wide temperature environments. They are capable of running as low as -20C and as high as +70C.

USB 3.1

This system features the latest USB 3.1 ports for fast communication to peripheral devices.

TPM

Trusted Platform Module (TPM) is an international standard for a secure cryptoprocessor, a dedicated microcontroller designed to secure hardware through integrated cryptographic keys.

CE

CE is a mandatory standard for products on the market in the European Economic Area. By CE marking a product, the manufacturer ensures that the item meets the essential safety requirements set out in the applicable CE directive.

RoHS

This product fully adheres to the Restriction of Hazardous Substances Directive 2002/95/EC, RoHS for short.  The directive covers the restriction of use of certain hazardous substances in electrical and electronic equipment and was adopted in February 2003 by the European Union.

FCC Approved

The Federal Communications Commission (FCC) is an independent agency of the United States government that sets standards and governs the testing of conducted and radiated emissions such as EMI.

M.2

M.2, formerly known as the Next Generation Form Factor (NGFF), is a specification for internally mounted computer expansion cards and associated connectors. M.2 replaces the mSATA standard, which uses the PCI Express Mini Card physical card layout and connectors. Employing a more flexible physical specification, the M.2 allows different module widths and lengths, and, paired with the availability of more advanced interfacing features, makes the M.2 more suitable than mSATA in general for solid-state storage applications

MiniPCI Express

This system features one or more miniPCI Express (mPCIe) slots for board level expansion.